Logo

Three-Dimensional Parallel Adaptive Finite Element Method and its Application in EDA

Speaker

Tao Cui, Academy of Mathematics and Systems Science, Chinese Academy of Sciences

Time

2019.09.26 14:00-15:00

Venue

Room 306, No.5 Science Building

Abstract

EDA is the abbreviation of Electronic Design Automation. Engineers use EDA software to automate the whole process of circuit design, performance analysis and design of IC layout. EDA software is the supporting tool of IC industry. EDA tools such as device simulation, optical correction, yield analysis and optimization, and interconnect parasitics extraction involve a large number of field-pass coupling simulation problems, so the field solver is one of the important cores of EDA tools. This report will introduce the field solver research for solving interconnect parameter extraction problems and 3D chip thermal stress analysis problems, including: modeling, parallel adaptive finite element algorithm design and its parallel implementation. Based on the parallel adaptive finite element programming framework PHG we are developing, we have developed an interconnect line parameter extraction tool based on the adaptive finite element method, and implemented tens of thousands of processor cores and actual circuit simulations with over 1 billion degrees of freedom on the “Tianhe” series of supercomputers in China.